Systems and methods for aligning measurement device in substrate processing systems
US10312121B2 · kind B2 · utility
1Cited by
13References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2017 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Mar 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support in a substrate processing system includes an inner portion arranged to support a substrate, an edge ring surrounding the inner portion, and a controller. The controller, to selectively cause the edge ring to engage the substrate and tilt the substrate, controls at least one actuator to at least one of raise and lower the edge ring and raise and lower the inner portion of the substrate support. The controller determines an alignment of a measurement device in the substrate processing system based on a signal reflected from a surface of the substrate when the substrate is tilted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.