Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance
US10312196B2 · kind B2 · utility
2Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2018 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Apr 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package may include a package substrate to which a first semiconductor chip is attached, an encapsulant covering the first semiconductor chip, and an indicator disposed within the semiconductor package. A side surface of the indicator is exposed at a side surface of the semiconductor package, and a width of a vertical section of the indicator parallel with the exposed side surface of the indicator varies as the vertical section of the indicator becomes farther from the side surface of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.