Low crosstalk vertical connection interface
US10314163B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2017 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | May 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06517
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device having a vertical connection interfaces for coupling stacked components are provided that improve communication between the stacked components. The techniques described herein allow for increased signal connection density while reducing potential for crosstalk. For example, a ground to signal ratio of connections between components in a vertical interface configured to carry ground signals relative to connections configured to carry data signals within a bank of connections has an edge to center gradient which reduces the amount of ground connections needed to meet crosstalk thresholds, while increasing the amount of signal connections available for communication between components across the vertical interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.