Hong Shi
10Patents
2h-index
20Co-inventors
46Inventor score
Filing activity: May 17, 2017 → Apr 19, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10057976B1 | Power-ground co-reference transceiver structure to deliver ultra-low crosstalk | Electricity | 6 | Active |
| US11043484B1 | Method and apparatus of package enabled ESD protection | Electricity | 3 | Active |
| US11950358B1 | Integrated circuit package with voltage droop mitigation | Electricity | 1 | Active |
| US10770364B2 | Chip scale package (CSP) including shim die | Electricity | 0 | Active |
| US11735519B2 | In-package passive inductive element for reflection mitigation | Electricity | 0 | Active |
| US12136613B2 | Chip package with near-die integrated passive device | Electricity | 0 | Active |
| US11302674B2 | Modular stacked silicon package assembly | Electricity | 0 | Active |
| US10314163B2 | Low crosstalk vertical connection interface | Electricity | 0 | Active |
| US12354978B2 | Coupled loop and void structure integrated in a redistribution layer of a chip package | Electricity | 0 | Active |
| US11688675B1 | Core cavity noise isolation structure for use in chip packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.