Injector for forming films respectively on a stack of wafers
US10316411B2 · kind B2 · utility
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3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2015 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Feb 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An injector for forming films respectively on a stack of wafers is provided. The injector includes a plurality of hole structures. Every adjacent two of the wafers have therebetween a wafer spacing, and each of the wafers has a working surface. The hole structures respectively correspond to the respective wafer spacings. The working surface and a respective hole structure have therebetween a parallel distance. The parallel distance is larger than a half of the wafer spacing. A wafer processing apparatus and a method for forming films respectively on a stack of wafers are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.