Brian Wang
5Patents
2h-index
8Co-inventors
40Inventor score
Filing activity: Apr 27, 1998 → Mar 23, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6200897A | Method for manufacturing even dielectric layer | Electricity | 328 | Expired |
| US7336098B2 | High speed memory modules utilizing on-pin capacitors | Physics | 6 | Expired |
| US6277754A | Method of planarizing dielectric layer | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9017763B2 | Injector for forming films respectively on a stack of wafers | Electricity | 0 | Active |
| US10316411B2 | Injector for forming films respectively on a stack of wafers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.