Patent · US Active

Apparatus utilizing computer on package construction

US10317938B2 · kind B2 · utility

2Cited by

3References

22Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Eng Huat Goh · Air Itam, MY
Khai Ern See · Batu Gajah, MY
Damien Weng Kong Chong · Kampung Jawa, MY
Min Suet Lim · Kampung Bukit Kechil, MY
Ping Ping Ooi · Butterworth, MY
Chu Aun Lim · Bukit Mertajam, MY
Jimmy Huang · San Jose, US
Poh Tat Oh · Bayan Lepas, MY
Teong Keat Beh · Bayan Lepas, MY
Jackson Chung Peng Kong · Merang, MY
Fern Nee Tan · Kuala Lumpur, MY
Jenn Chuan Cheng · Bukit Mertajam, MY

Key dates

Filing date	Jan 23, 2015
Grant date	Jun 11, 2019
Priority date	—
Expiry date	Jan 23, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.