Object preparation device and particle beam device with an object preparation device and method for operating the particle beam device
US10319561B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2018 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Feb 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/226
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An object preparation device for preparing an object in a particle beam apparatus includes at least one cutting device, at least one cutting bevel for cutting the object, where the cutting bevel is arranged at the cutting device, at least one movably embodied object receptacle device having an object receptacle for receiving the object, and at least one drive unit for moving the object receptacle device from a first position of the object receptacle device into a second position of the object receptacle device. The first position of the object receptacle device is an initial position. The second position of the object receptacle device is an analysis and/or processing position of the object receptacle device. An observation axis (OA) extends through the object receptacle when the object receptacle device is arranged at the second position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.