Adhesive-bonded thermal interface structures
US10319609B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2017 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Jun 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3736
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.