Patent · US Active

Antenna on ceramics for a packaged die

US10319688B2 · kind B2 · utility

17Cited by

7References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Andreas Wolter · Regensburg, DE
Saravana Maruthamuthu · Munich, DE
Mikael Bergholz Knudsen · Gistrup, DK
Thorsten Meyer · Regensburg, DE
Georg Seidemann · Landshut, DE
Pablo Herrero · Munich, DE
Pauli Jaervinen · Wallerfing, DE

Key dates

Filing date	Dec 9, 2013
Grant date	Jun 11, 2019
Priority date	—
Expiry date	Jan 6, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.