Patent · US Active

Semiconductor packages and methods of fabrication thereof

US10325834B2 · kind B2 · utility

0Cited by

3References

22Claims

0Family size

Assignee

Infineon Technologies Dresden GmbH & Co. KG · DE

Inventors

Dirk Meinhold · Dresden, DE
Frank Daeche · Unterhaching, DE
Thorsten Scharf · Regensburg, DE

Key dates

Filing date	Aug 9, 2017
Grant date	Jun 18, 2019
Priority date	—
Expiry date	Sep 2, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/206
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In accordance with an embodiment of the present invention, a semiconductor device includes a semiconductor chip having a first side and an opposite second side, and a chip contact pad disposed on the first side of the semiconductor chip. A dielectric liner is disposed over the semiconductor chip. The dielectric liner includes a plurality of openings over the chip contact pad. A interconnect contacts the semiconductor chip through the plurality of openings at the chip contact pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.