Substrate treatment method, computer storage medium and substrate treatment system
US10329144B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2016 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Feb 10, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0149
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treatment method using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer includes a polymer separating step, wherein a ratio of a molecular weight of the hydrophilic polymer in the block copolymer is adjusted to 20% to 40% so that the hydrophilic polymers align at positions corresponding to a hexagonal close-packed structure in a plan view after the polymer separating step, and at the polymer separating step, a columnar first hydrophilic polymer is phase-separated on each of circular patterns of hydrophobic coating films and a columnar second hydrophilic polymer is phase-separated between the first hydrophilic polymers, and a diameter of the circular pattern is set so that the first hydrophilic polymers and the second hydrophilic polymers align at positions corresponding to the hexagonal close-packed structure in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.