Patent · US Active

Bonded system and a method for adhesively bonding a hygroscopic material

US10332814B2 · kind B2 · utility

2Cited by

4References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Claus von Waechter · Sinzing, DE
Christian Altschaeffl · Vilsheim, DE
Holger Doepke · Sinzing, DE
Uwe Hoeckele · Regensburg, DE
Franz-Xaver Muehlbauer · Rimbach, DE
Daniel Porwol · Straubing, DE
Tobias Schmidt · Munich, DE
Christian Schweiger · Wilhelmsfeld, DE
Carsten von Koblinski · Velden am Wörther See, AT

Key dates

Filing date	Feb 18, 2016
Grant date	Jun 25, 2019
Priority date	—
Expiry date	Feb 20, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.