Method and apparatus for encapsulation of an organic light emitting diode
US10333104B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2017 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Nov 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/10
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A substrate includes a plurality of OLED, each having a conductor layer. A coating is formed over the OLEDs, the coating comprises a first inorganic layer formed over the OLED structures and at least partially over each of the contact layers, a buffer layer over the first inorganic layer, a second inorganic layer over the buffer layer, wherein the buffer layer comprises a first inorganic interface layer in contact with the first inorganic layer, a second inorganic interface layer in contact with the second inorganic layer, and an organic layer sandwiched between the first and second inorganic interface layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.