Permanent secondary erosion containment for electrostatic chuck bonds
US10340171B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 18, 2016 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Dec 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support in a substrate processing system includes a baseplate, a ceramic layer, and a bond layer. The ceramic layer is arranged on the baseplate to support a substrate. The bond layer is arranged between the ceramic layer and the baseplate. A seal is arranged between the ceramic layer and the baseplate around an outer perimeter of the bond layer. The seal includes an inner layer formed adjacent to the bond layer and an outer layer formed adjacent to the inner layer such that the inner layer is between the outer layer and the bond layer. The inner layer comprises a first material and the outer layer comprises a second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.