Patent · US Active

Integrated circuit substrate having configurable circuit elements

US10340197B2 · kind B2 · utility

0Cited by

3References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Claudia Sgiarovello · Villach, AT
Martin Mischitz · Wernberg, AT
Andrew Christopher Graeme Wood · St. Jakob im Rosental, AT

Key dates

Filing date	Jun 8, 2017
Grant date	Jul 2, 2019
Priority date	—
Expiry date	Jun 8, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/5252
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A die includes a plurality of dielectric landings and a conductive material distributed across one or more of the plurality of dielectric landings. Each one of the plurality of dielectric landings electrically separates two conductive landings associated with the one of the plurality of dielectric landings. The conductive material establishes an electrical connection between the two conductive landings associated with the one or more of the plurality of dielectric landings.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.