Mixed impedance leads for die packages and method of making the same
US10340209B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Jul 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die package having mixed impedance leads where a first lead has a first metal core, and a dielectric layer surrounding the first metal core, and a second lead has a second metal core, and a second dielectric layer surrounding the second metal core, with the dielectric thicknesses differing from each other. A method of making a die package having leads with different impedances formed by connecting the die package to the die substrate connection pads via a first wirebond having a first metal core, depositing a dielectric layer on the wirebond metal core, metalizing the dielectric layer, connecting the die package to the die substrate connection pads via a second wirebond having a second metal core, depositing a dielectric layer on the second wirebond second metal core, and metalizing the dielectric layer on the second metal core, such that the first wirebond has a different impedance than the second wire bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.