Eric A. Sanjuan
11Patents
2h-index
1Co-inventors
36Inventor score
Filing activity: Dec 19, 2007 → Jul 2, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8581113B2 | Low cost high frequency device package and methods | Emerging Cross-Sectional Technologies | 2 | Active |
| US8839508B2 | Method of making a high frequency device package | Emerging Cross-Sectional Technologies | 2 | Active |
| US9859188B2 | Heat isolation structures for high bandwidth interconnects | Electricity | 1 | Active |
| US10340209B2 | Mixed impedance leads for die packages and method of making the same | Electricity | 0 | Active |
| US9824997B2 | Die package with low electromagnetic interference interconnection | Electricity | 0 | Active |
| US9673137B2 | Electronic device having a lead with selectively modified electrical properties | Electricity | 0 | Active |
| US9960468B2 | Metalized molded plastic components for millimeter wave electronics and method for manufacture | Emerging Cross-Sectional Technologies | 0 | Active |
| US9275961B2 | Low cost high frequency device package and methods | Emerging Cross-Sectional Technologies | 0 | Active |
| US9997489B2 | Coated bond wires for die packages and methods of manufacturing said coated bond wires | Electricity | 0 | Active |
| US9711479B2 | Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same | Electricity | 0 | Active |
| US9812420B2 | Die packaging with fully or partially fused dielectric leads | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.