Methods and systems for chemical mechanical planarization endpoint detection using an alternating current reference signal
US10343253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2014 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Oct 11, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/27
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods, non-transitory computer readable media, and systems are provided for detecting an endpoint of a chemical mechanical planarization (CMP) process on a semiconductor substrate. The method comprises generating a reference signal, generating a first signal with which to control a CMP system, generating a second signal using a combination of the first signal and the reference signal, commanding the CMP system with the second signal, generating a response signal that indicates an operational characteristic of the CMP system that is responsive to the second signal and a friction property of the semiconductor substrate, and filtering the response signal using the reference signal to determine the endpoint of the CMP process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.