Production of an integrated circuit including electrical contact on SiC
US10347490B2 · kind B2 · utility
1Cited by
18References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2017 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Feb 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/64
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Production of an integrated circuit including an electrical contact on SiC is disclosed. One embodiment provides for production of an electrical contact on an SiC substrate, in which a conductive contact is produced on a boundary surface of the SiC substrate by irradiation and absorption of a laser pulse on an SiC substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.