Patent · US Active

Low thermal resistance hanging die package

US10347558B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Christian Geissler · Teugn, DE
Georg Seidemann · Landshut, DE
Sonja Koller · Regensburg, DE
Jan Proschwitz · Riesa, DE

Key dates

Filing date	Aug 31, 2015
Grant date	Jul 9, 2019
Priority date	—
Expiry date	Aug 31, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments herein generally relate to the field of package assembly to facilitate thermal conductivity. A package may have a hanging die, and attach to a printed circuit board (PCB). The package may have an active side plane and an inactive side plane opposite the first active side plane. The package may also have a ball grid array (BGA) matrix having a height determined by a distance of a furthest point of the BGA matrix from the active side plane of the package. The package may have a hanging die attached to the active side plane of the package, the hanging die having a z-height greater than the BGA matrix height. When package is attached to the PCB, the hanging die may fit into an area on the PCB that is recessed or has been cut away, and a thermal conductive material may connect the hanging die and the PCB.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.