Patent · US Active

Method for producing a chip module

US10354971B2 · kind B2 · utility

2Cited by

3References

13Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Ghassem Azdasht · Berlin, DE
Thorsten Teutsch · Berlin, DE
Ricardo Geelhaar · Berlin, DE

Key dates

Filing date	Nov 25, 2014
Grant date	Jul 16, 2019
Priority date	—
Expiry date	Nov 25, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/92224
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention concerns a method for producing a chip module having a carrier substrate and at least one chip arranged on the carrier substrate, as well as a contact conductor arrangement for connecting chip pads to contacts arranged on a contact face of the chip module, in which method the front face of the chip which is provided with the chip pads is secured to the carrier substrate and then the contact conductor arrangement is formed by structuring of a contact material layer of the carrier substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.