Thorsten Teutsch
4Patents
1h-index
4Co-inventors
37Inventor score
Filing activity: Oct 5, 2001 → Nov 25, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10354971B2 | Method for producing a chip module | Electricity | 2 | Active |
| US7481352B2 | Method for ablating points of contact (debumping) | Electricity | 1 | Expired |
| US8497578B2 | Terminal face contact structure and method of making same | Electricity | 0 | Active |
| US8742571B2 | Diode array and method for producing a diode array | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.