Dual-sided die packages

US10361142B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Henning Braunisch · Chandler, US
• Feras Eid · Chandler, US
• Adel A. Elsherbini · Chandler, US
• Johanna M. Swan · Scottsdale, US
• Don Nelson · Beaverton, US

Key dates

• Filing date: Jun 16, 2017
• Grant date: Jul 23, 2019
• Expiry date: Jun 16, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10545
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.