Don Nelson
4Patents
1h-index
8Co-inventors
33Inventor score
Filing activity: Mar 13, 2013 → Jun 16, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9711428B2 | Dual-sided die packages | Electricity | 4 | Active |
| US10361142B2 | Dual-sided die packages | Electricity | 1 | Active |
| US9490201B2 | Methods of forming under device interconnect structures | Electricity | 0 | Active |
| US9721898B2 | Methods of forming under device interconnect structures | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.