Method of detecting a condition
US10366899B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2017 |
| Grant date | Jul 30, 2019 |
| Priority date | — |
| Expiry date | Jun 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/088
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is for detecting a condition associated with a final phase of a plasma dicing process. The method includes providing a non-metallic substrate having a plurality of dicing lanes defined thereon, plasma etching through the substrate along the dicing lanes, wherein during the plasma etching infrared emission emanating from at least a portion of the dicing lanes is monitored so that an increase in infrared emission from the dicing lanes is observed as the final phase of the plasma dicing operation is entered, and detecting the condition associated with the final phase of the plasma dicing from the monitored infrared emission.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.