Methods of manufacturing a multi-device package
US10373922B2 · kind B2 · utility
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2References
9Claims
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Key dates
| Filing date | Jun 4, 2015 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Aug 4, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-device package includes a substrate, at least two device regions, a first redistribution layer, an external chip and a plurality of first connectors. The two device regions are formed from the substrate, and the first redistribution layer is disposed on the substrate and electrically connected to the two device regions. The external chip is disposed on the first redistribution layer, and the first connectors are interposed between the first redistribution layer and the external chip to interconnect the two.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.