Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool
US10379061B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2017 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Jan 15, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.