In-die transistor characterization in an IC

US10379155B2 · kind B2 · utility

Assignee

• XILINX, INC. · US

Inventors

• Ping-Chin Yeh · San Jose, US
• John K. Jennings · Dunleary, IE
• Rhesa Nathanael · Emeryville, US
• Nui Chong · San Jose, US
• Cheang-Whang Chang · Mountain View, US
• Daniel Chung · San Ramon, US

Key dates

• Filing date: Oct 2, 2014
• Grant date: Aug 13, 2019
• Expiry date: Jun 2, 2036

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2843
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In an example implementation, an integrated circuit (IC) includes: a plurality of transistors disposed in a plurality of locations on a die of the IC; conductors coupled to terminals of each of the plurality of transistors; a digital-to-analog converter (DAC), coupled to the conductors, to drive voltage signals to the plurality of transistors in response to a digital input; and an analog-to-digital converter (ADC), coupled to at least a portion of the conductors, to generate samples in response to current signals induced in the plurality of transistors in response to the voltage signals, the samples being indicative of at least one electrostatic characteristic for the plurality of transistors.