Substrate processing apparatus
US10381246B2 · kind B2 · utility
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12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2017 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Nov 8, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate processing apparatus including: a container body configured to accommodate a substrate and perform a processing on the substrate using a high-pressure processing fluid; a conveyance port configured to carry the substrate into and out of the container body; an opening formed in the container body at a position different from the conveyance port; and a cover member configured to close the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.