Patent · US Active

Method for polymer-assisted chip transfer

US10388516B1 · kind B1 · utility

0Cited by

3References

17Claims

0Family size

Assignee

Facebook Technologies, LLC · US

Inventors

Oscar Torrents Abad · Riegelsberg, DE
Pooya Saketi · Cork, IE
Daniel Brodoceanu · Cork, IE
Karsten Moh · Riegelsberg, DE

Key dates

Filing date	Jan 10, 2018
Grant date	Aug 20, 2019
Priority date	—
Expiry date	Jan 10, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/98
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.