Patent · US Active

Die attach methods and semiconductor devices manufactured based on such methods

US10396015B2 · kind B2 · utility

2Cited by

7References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Benjamin Reichert · Lappersdorf, DE
Chen Wen Lee · Ipoh, MY
Giovanni Ragasa Garbin · Melaka City, MY
Peter Strobel · Regensburg, DE

Key dates

Filing date	Jul 31, 2017
Grant date	Aug 27, 2019
Priority date	—
Expiry date	Jul 31, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/07811
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a carrier, a semiconductor die and a die attach material arranged between the carrier and the semiconductor die. A fillet height of the die attach material is less than about 95% of a height of the semiconductor die. A maximum extension of the die attach material over edges of a main surface of the semiconductor die facing the die attach material is less than about 200 micrometers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.