Peter Strobel
30Patents
5h-index
48Co-inventors
69Inventor score
Filing activity: Sep 20, 2001 → Oct 14, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7276785B2 | Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof | Electricity | 65 | Expired |
| US7420262B2 | Electronic component and semiconductor wafer, and method for producing the same | Electricity | 42 | Expired |
| US7943423B2 | Reconfigured wafer alignment | Electricity | 20 | Active |
| US7575173B2 | Smart card, smart card module, and a method for production of a smart card module | Electricity | 18 | Expired |
| US7379239B2 | Zero-degree assistant's device for a microscope | Physics | 5 | Active |
| US7136221B2 | Microscope with a handle and/or hand-grip for a microscope | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7700956B2 | Sensor component and panel used for the production thereof | Electricity | 4 | Expired |
| US7524699B2 | Electronic component and a panel | Electricity | 3 | Expired |
| US9673170B2 | Batch process for connecting chips to a carrier | Electricity | 2 | Active |
| US7470601B2 | Semiconductor device with semiconductor chip and adhesive film and method for producing the same | Electricity | 2 | Active |
| US10396015B2 | Die attach methods and semiconductor devices manufactured based on such methods | Electricity | 2 | Active |
| US8154795B2 | Stereo microscope with beam splitter device | Human Necessities | 2 | Active |
| US7893532B2 | External contact material for external contacts of a semiconductor device and method of making the same | Electricity | 1 | Active |
| US7391103B2 | Electronic module having plug contacts and method for producing it | Electricity | 1 | Expired |
| US7547645B2 | Method for coating a structure comprising semiconductor chips | Electricity | 1 | Active |
| US10832992B2 | Die attach methods and semiconductor devices manufactured based on such methods | Electricity | 1 | Active |
| US11296015B2 | Die attach methods and semiconductor devices manufactured based on such methods | Electricity | 0 | Active |
| US7602614B2 | Electronic module and method for the production thereof | Electricity | 0 | Expired |
| US7327023B2 | Semiconductor component with plastic housing, and process for producing the same | Electricity | 0 | Expired |
| US12111209B2 | Compact diffraction limited near infrared (NIR) spectrometers and related detectors | Physics | 0 | Active |
| US7772105B2 | Semiconductor component with plastic housing, and process for producing the same | Electricity | 0 | Active |
| US9349680B2 | Chip arrangement and method of manufacturing the same | Electricity | 0 | Active |
| US7919857B2 | Plastic housing and semiconductor component with said plastic housing | Electricity | 0 | Active |
| US11710684B2 | Package with separate substrate sections | Electricity | 0 | Active |
| US7592236B2 | Method for applying a structure of joining material to the back surfaces of semiconductor chips | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.