Patent · US Active

System-in-package devices and methods for forming system-in-package devices

US10403609B2 · kind B2 · utility

6Cited by

3References

25Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Christian Geissler · Teugn, DE
Sven Albers · Regensburg, DE
Georg Seidemann · Landshut, DE
Andreas Wolter · Regensburg, DE
Klaus Reingruber · Langquaid, DE
Thomas Wagner · Regelsbach, DE
Marc Dittes · Regensburg, DE

Key dates

Filing date	Dec 21, 2015
Grant date	Sep 3, 2019
Priority date	—
Expiry date	Dec 21, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system-in-package device includes at least three electrical device components arranged in a common package. A first electrical device component includes a first vertical dimension, a second electrical device component includes a second vertical dimension and a third electrical device component comprises a third vertical dimension. The first electrical device component and the second electrical device component are arranged side by side in the common package. Further, the third electrical device component is arranged on top of the first electrical device component in the common package. At least a part of the third electrical device component is arranged vertically between a front side level of the second electrical device component and a back side level of the second electrical device component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.