Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine

US10407594B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Bastian Marten Noller · Lorsch, DE
• Yuzhuo Li
• Diana Franz · Kohlhof, DE
• Kenneth Rushing · Ludwigshafen, DE
• Michael Lauter · Mannheim, DE
• Daniel Kwo-Hung Shen · Taichung, TW
• Yongqing Lan · Potsdam, US
• Zhenyu Bao · Potsdam, US

Key dates

• Filing date: Mar 19, 2012
• Grant date: Sep 10, 2019
• Expiry date: Mar 19, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/30625
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A chemical-mechanical polishing (CMP) composition comprising (A) inorganic particles, organic particles, or a composite or mixture thereof, (B) a polymeric polyamine or a salt thereof comprising at least one type of pendant group (Y) which comprises at least one moiety (Z), wherein (Z) is a carboxylate (—COOR1), sulfonate (—SO3R2), sulfate (—O—SO3R3), phosphonate (—P(═O)(OR4)(OR5)), phosphate (—O—P(═O)(OR6)(OR7)), carboxylic acid (—COOH), sulfonic acid (—SO3H), sulfuric acid (—O—SO3—), phosphonic acid (—P(═O)(OH)2), phosphoric acid (—O—P(═O)(OH)2) moiety, or their deprotonated forms, R1 is alkyl, aryl, alkylaryl, or arylalkyl R2 is alkyl, aryl, alkylaryl, or arylalkyl, R3 is alkyl, aryl, alkylaryl, or arylalkyl, R4 is alkyl, aryl, alkylaryl, or arylalkyl, R5 is H, alkyl, aryl, alkylaryl, or arylalkyl, R6 is alkyl, aryl, alkylaryl, or arylalkyl, R7 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.