Microelectronic package with illuminated backside exterior

US10411000B2 · kind B2 · utility

Assignee

• Intel IP Corporation · US

Inventors

• Marc Dittes · Regensburg, DE
• Sven Albers · Regensburg, DE
• Christian Geissler · Teugn, DE
• Andreas Wolter · Regensburg, DE
• Klaus Reingruber · Langquaid, DE
• Georg Seidemann · Landshut, DE
• Thomas Wagner · Regelsbach, DE
• Richard Patten · Minneapolis, US

Key dates

• Filing date: Mar 31, 2016
• Grant date: Sep 10, 2019
• Expiry date: Jan 8, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A microelectronic package is described with an illuminated backside exterior. In one example, the package has a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.