Apparatus and method for regulating surface temperature of polishing pad
US10414018B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2017 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Feb 17, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.