Patent · US Active

Distributed electrode array for plasma processing

US10418225B2 · kind B2 · utility

3Cited by
19References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 21, 2018
Grant dateSep 17, 2019
Priority date
Expiry dateAug 21, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/32568
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

Embodiments of the disclosure provide a plasma source assembly and process chamber design that can be used for any number of substrate processing techniques. The plasma source may include a plurality of discrete electrodes that are integrated with a reference electrode and a gas feed structure to generate a uniform, stable and repeatable plasma during processing. The plurality of discrete electrodes include an array of electrodes that can be biased separately, in groups or all in unison, relative to a reference electrode. The plurality of discrete electrodes may include a plurality of conductive rods that are positioned to generate a plasma within a processing region of a process chamber. The plurality of discrete electrodes is provided RF power from standing or traveling waves imposed on a power distribution element to which the electrodes are connected.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.