Methods of sealing openings, and methods of forming integrated assemblies
US10418275B1 · kind B1 · utility
2Cited by
3References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2019 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Mar 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/485
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments include a method of forming an integrated assembly. A construction is formed to include a structure having an exposed surface, and to include an opening proximate the structure. An aperture extends into the opening. A first material is deposited to form a mass along the exposed surface of the structure. Particles are sputtered from the mass and across the aperture. The particles agglomerate to form a sealant material which traps a void within the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.