Patent · US Active

Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same

US10420204B2 · kind B2 · utility

10Cited by
4References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 7, 2015
Grant dateSep 17, 2019
Priority date
Expiry dateFeb 10, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/858
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A method of making a wiring board having an electrical isolator and metal posts incorporated in a resin core is characterized by the provision of moisture inhibiting caps covering interfaces between the electrical isolator/metal posts and a surrounding plastic material. In a preferred embodiment, the electrical isolator and metal posts are bonded to the resin core by an adhesive substantially coplanar with the metal films on the electrical isolator, the metal posts and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the electrical isolator/metal posts and the surrounding plastic material. Conductive traces are also deposited on the smoothed lapped top surface to provide electrical contacts for chip connection and electrically coupled to the metal posts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.