Substrate transfer device and bonding system
US10424502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2017 |
| Grant date | Sep 24, 2019 |
| Priority date | — |
| Expiry date | Jul 7, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.