Patent · US Active

Method for producing a multilayer MEMS component, and corresponding multilayer MEMS component

US10427937B2 · kind B2 · utility

0Cited by

2References

14Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Arnd Kaelberer · Neckargemünd, DE
Christian Zielke · Eningen unter Achalm, DE
Hans Artmann · Magstadt, DE
Oliver Breitschaedel · Gomaringen, DE
Peter Borwin Staffeld · Stuttgart, DE

Key dates

Filing date	Nov 30, 2016
Grant date	Oct 1, 2019
Priority date	—
Expiry date	Nov 30, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2201/0195
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for manufacturing a multi-layer MEMS component includes: providing a multi-layer substrate that has a monocrystalline carrier layer, a monocrystalline functional layer having a front side and a back side, and a bonding layer located between the back side and the carrier layer; growing a first polycrystalline layer over the front side of the monocrystalline functional layer; removing the monocrystalline carrier layer; and growing a second polycrystalline layer over the back side of the monocrystalline functional layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.