Patent · US Active

Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same

US10431545B2 · kind B2 · utility

0Cited by

1References

11Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Georg Seidemann · Landshut, DE
Bernd Waidhas · Nittendorf, DE
Thomas Wagner · Regelsbach, DE
Andreas Wolter · Regensburg, DE
Laurent Millou · Munich, DE

Key dates

Filing date	Jun 29, 2017
Grant date	Oct 1, 2019
Priority date	—
Expiry date	Jun 29, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15313
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A multi-chip module includes two silicon bridge interconnects and three components that are tied together by the bridges with one of the components in the center. At least one of the silicon bridge interconnects is bent to create a non-planar chip-module form factor. Cross-connected multi-chip silicon bent-bridge interconnect modules include the two silicon bridges contacting the center component at right angles to each other, plus a fourth component and a third silicon bridge interconnect contacting the fourth component and any one of the original three components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.