Metrology by reconstruction
US10437158B2 · kind B2 · utility
2Cited by
5References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2016 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Dec 16, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70158
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed herein is a method comprising: obtaining a plurality of measurement results from a pattern on a substrate respectively using a plurality of substrate measurement recipes, the substrate processed by a lithography process; reconstruct, using a computer, the pattern using the plurality of measurement results, to obtain a reconstructed pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.