Substrate processing apparatus and pipe cleaning method for substrate processing apparatus
US10438818B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2015 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Aug 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. The substrate processing apparatus includes: a first cleaning lane including first cleaning units (52), (54) each for cleaning a substrate while supplying pure water to the substrate; a second cleaning lane including second cleaning units (60), (62) each for cleaning a substrate while supplying pure water to the substrate; a first pure-water supply pipe (120) for supplying the pure water to the first cleaning lane; and a second pure-water supply pipe (180) for supplying the pure water to the second cleaning lane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.