Patent · US Active

Multi-chip packages with stabilized die pads

US10438877B1 · kind B1 · utility

0Cited by

16References

20Claims

0Family size

Assignee

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · US

Inventors

Jose Felixminia PALAGUD, JR. · Seremban, MY
Soon Wei WANG · Seremban, MY

Key dates

Filing date	Mar 13, 2018
Grant date	Oct 8, 2019
Priority date	—
Expiry date	Mar 13, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/92247
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a general aspect, a multi-chip semiconductor device package assembly can include a leadframe having a first die pad and a second die pad. The assembly can further include a first semiconductor die coupled to the first die pad and a second semiconductor die coupled to the second die pad. The assembly can also include a blank having a first portion coupled to the first die pad and a second portion coupled to the second die pad, such that the blank forms a bridge between the first die pad and the second die pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.