Inventor · Seremban, MY

Soon Wei WANG

35Patents
3h-index
16Co-inventors
56Inventor score

Filing activity: Mar 17, 2008 → Jun 13, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10199311B2 Leadless semiconductor packages, leadframes therefor, and methods of making Electricity 5 Active
US9281258B1 Chip scale packages and related methods Electricity 4 Active
US8451621B2 Semiconductor component and method of manufacture Emerging Cross-Sectional Technologies 3 Active
US7939380B2 Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure Electricity 3 Active
US8449339B2 Connector assembly and method of manufacture Emerging Cross-Sectional Technologies 3 Active
US10756006B2 Leadless semiconductor packages, leadframes therefor, and methods of making Electricity 1 Active
US10825754B2 Quad flat no leads package with locking feature Electricity 1 Active
US11532539B2 Semiconductor package with wettable flank Electricity 1 Active
US10930604B2 Ultra-thin multichip power devices Electricity 1 Active
US9748163B1 Die support for enlarging die size Electricity 1 Active
US11721654B2 Ultra-thin multichip power devices Electricity 1 Active
US11404276B2 Semiconductor packages with thin die and related methods Electricity 0 Active
US10559510B2 Molded wafer level packaging Electricity 0 Active
US10971429B2 Method for forming a semiconductor package Electricity 0 Active
US12374554B2 Semiconductor packages with die including cavities and related methods Electricity 0 Active
US10438877B1 Multi-chip packages with stabilized die pads Electricity 0 Active
US11361970B2 Silicon-on-insulator die support structures and related methods Electricity 0 Active
US11901184B2 Backmetal removal methods Emerging Cross-Sectional Technologies 0 Active
US12040192B2 Die sidewall coatings and related methods Electricity 0 Active
US11348796B2 Backmetal removal methods Emerging Cross-Sectional Technologies 0 Active
US10283466B2 Polymer resin and compression mold chip scale package Electricity 0 Active
US10607920B2 Semiconductor package Electricity 0 Active
US11404277B2 Die sidewall coatings and related methods Electricity 0 Active
US12176272B2 Semiconductor package with wettable flank Electricity 0 Active
US11508679B2 Polymer resin and compression mold chip scale package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.