Arc-resistant crackstop
US10438902B2 · kind B2 · utility
0Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2017 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Sep 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6605
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to arc resistant crackstop structures and methods of manufacture. The structure includes: a crackstop structure comprising dual rails surrounding an active area of an integrated circuit; and a through-BOx electrical contact electrically connecting each of the dual rails to an underlying substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.