Chip with integrated phosphor

US10439107B2 · kind B2 · utility

Assignee

• Cree, Inc. · US

Inventors

• Sten Heikman · Goleta, US
• James Ibbetson · Lompoc, US
• Zhimin Jamie Yao · Dallas, US
• Fan Zhang · Lake Barrington, US
• Matthew Donofrio · Raleigh, US
• Christopher P. Hussell · Cary, US
• John Edmond · Durham, US

Key dates

• Filing date: Oct 14, 2013
• Grant date: Oct 8, 2019
• Expiry date: Oct 14, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506

Abstract

This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.