Method of inspecting a specimen and system thereof
US10444274B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2018 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Jul 2, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/303
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
There is provided an inspection system for inspecting a specimen, an inspection unit capable to operate in conjunction with an inspection machine unit, a die layout clipping unit, methods of inspecting a specimen, and a method of providing a die layout clip. The method of inspecting a specimen comprises: obtaining location information indicative of coordinates of a potential defect of interest revealed in the specimen and of one or more inspected layers corresponding to the potential defect of interest; sending to a die layout clipping unit a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; receiving a die layout clip generated in accordance with the first data; specifying at least one inspection algorithm of the inspection area using information comprised in the die layout clip; and enabling inspection of the inspection area using the specified inspection algorithm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.